Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship

The Heat Pass Block first appeared in Samsung's 2nm Exynos 2600, reportedly delivering a 16 percent improvement in thermal resistance. It's a copper-based layer built directly onto the processor die, providing a direct pathway for heat to dissipate before it can radiate through surrounding components.Read Entire Article

Feb 9, 2026 - 01:05
 0
Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship
The Heat Pass Block first appeared in Samsung's 2nm Exynos 2600, reportedly delivering a 16 percent improvement in thermal resistance. It's a copper-based layer built directly onto the processor die, providing a direct pathway for heat to dissipate before it can radiate through surrounding components.

Read Entire Article

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